Plasma Enhanced Atomic Layer Deposition of Copper Thin Film using [Cu(iPr-amd)]2 as Precursor
Form: Author: Data: 2015-12-08
Liu Zhongwei,
Plasma Enhanced Atomic Layer Deposition of Copper Thin Film using [Cu(iPr-amd)]2 as Precursor,
The sixth International Symposium on Plasma Nanosciences (iPlasmaNano VI), 2015, August 25-29, Beijing (invited)
